The global flip chip packages market to grow
at a CAGR of over 6% during the period 2020-2024.The integration of
semiconductor components in automobiles is one of the major trends witnessed in
the global flip chip packages market
2018-2022. Semiconductor ICs are utilized for several automobile
applications, including airbag control systems, GPS, ABS, displays,
infotainment systems, power doors and windows, automated driving, and collision
detection technology. The growth in production of automobiles will increase the
need for small semiconductor devices, in turn, driving the demand for advanced
packaging solutions from the automotive sector.
According to Technavio’s analysts, one of the key factors contributing
to the growth of the global flip chip packages market is the increasing number
of fabs:
Global flip chip packages market: Increasing number of fabs
Semiconductor fabs manufacture a wide range of semiconductor devices and
components that are either designed by in-house firms known as IDMs or
manufactured based on the designs provided by clients. The rising application
of semiconductor components in several emerging technologies such as IoT and AI
has increased the need for silicon wafers, thereby increasing the demand for
more fabs.
This report is available at a USD 1,000 discount for a limited time
only: View market snapshot before
purchasing
Global flip chip packages market: Segmentation analysis
The global flip chip packages market research report provides market
segmentation by end-user (communication sector, computing and networking
sector, industrial sector, and automotive sector) and by region (the Americas,
APAC, and EMEA). It provides an in-depth analysis of the prominent factors
influencing the market, including drivers, opportunities, trends, and
industry-specific challenges.
Of the four major end-users, the communication sector held the largest
market share in 2017, contributing to over 40% of the market. This mainly
attributed to the high demand for the integration of quick, light, and
inexpensive components such as smartphones.
APAC held the largest share of the market in 2017, accounting for close
to 72% share. It was followed by the Americas and EMEA respectively. APAC is
expected to dominate the market throughout the period 2018-2022.
Looking for more information on this market? Request a free sample report
No comments:
Post a Comment